Particularly, this study details how a pre-existing groove (i.e., a laser-induced groove) on the front surface of the wafer interacts with the saw blade penetration-induced trench during the second step of the hybrid dicing process. This work shows that the adoption of the hybrid dicing technique induces sacrificial fracture at the laser-induced groove tip to save the regions outside of the groove formed along the scribe region of the wafer. This article demonstrates that the chipping damage resulting from silicon wafer separation can be more effectively suppressed by the adoption of hybrid dicing (a duel process that uses laser ablation prior to mechanical sawing) than single dicing, such as sawing.
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